Univerza v Tokiu je uspešno razvila novo tehnologijo za lasersko obdelavo steklenih substratov z mikro luknjo
Pred kratkim je Univerza v Tokiu napovedala uspešen razvoj "laserske tehnologije za obdelavo mikro luknjic" za naslednjo generacijo podloge za polprevodniške steklene podlage, ki lahko doseže visoko natančnost, izjemno majhno odprtino in visoko obdelavo mikro luknje na steklenih materialih ., ki se uporablja v eksperimentu, je "EN-A1" EN-A1 "EN-A1".
With the help of ultra-short pulse deep ultraviolet lasers, the team has achieved micron-level precision processing of glass materials-the diameter of the penetration hole is less than 10 microns, and the aspect ratio can reach 20:1. Previously, it was difficult to prepare high-aspect ratio hole structures based on acidic solution etching processes, and deep ultraviolet laser Tehnologija neposredne obdelave ni samo prebil tega ozkega grla, ampak je dosegla tudi visokokakovostno obdelavo lukenj brez razpok . Poleg tega ta postopek ne potrebuje kemijskih korakov, kar lahko znatno zmanjša okoljsko breme, ki ga povzroča obdelava tekočih odpadkov .
Mikroskopske slike mikropora, izvrtanih na EN-A1 steklu od zgoraj in stranjo
This achievement is an important milestone in the post-processing technology of next-generation semiconductor manufacturing. As the substrate core material and interposer material transition to glass-based, this technology provides a key solution for through-hole processing of glass substrates. In the future, it is expected to promote the development of semiconductor devices towards smaller size and higher integration complexity in chiplet tehnologija .
